On-chip tensile testing of the mechanical and electro-mechanical properties of nano-scale silicon free-standing beams

Advanced Materials Research

Volumn 276, Issue , 2011, Pages 117-126

  Bhaskar, Umesh ^a   Passi, Vikram ^a   Zulfiqar, Azeem ^a   Sodervall, Ulf ^b   Nilsson, Bengt ^b   Petersson, Goran ^b   Hagberg, Mats ^b   Pardoen, Thomas ^a   Raskin, Jean Pierre ^a  

^a UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Environmental impact on measurement; Fracture; Fracture strength of silicon; Mechanical and electro mechanical properties of silicon; MEMS NEMS; Nano mechanical testing; On chip tensile testing; Piezoresistivity; Silicon nanowires; Surface states; Thin film testing

Indexed keywords

ELECTROMECHANICAL PROPERTY; MEMS/NEMS; NANO-MECHANICAL TESTING; ON CHIPS; PIEZORESISTIVITY; SILICON NANOWIRES; SURFACE STATES;

CHARACTERIZATION; ENVIRONMENTAL IMPACT; INSULATING MATERIALS; KNIT FABRICS; MATERIALS TESTING; MATERIALS TESTING APPARATUS; NANOSENSORS; NANOWIRES; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICES; STRAIN; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS;

FRACTURE;

EID: 79960414165     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.276.117     Document Type: Article

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