Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process

Materials and Design

Volumn 32, Issue 6, 2011, Pages 3189-3197

  Amalu, E H ^a   Ekere, N N ^a   Mallik, S ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

D. Adhesives; F. Elastic and plastic behaviour; G. Non destructive testing (NDT)

Indexed keywords

CAVITY DIMENSION; CHARACTERISATION; CU SUBSTRATE; D. ADHESIVES; DEFORMATION BEHAVIOUR; F. ELASTIC AND PLASTIC BEHAVIOUR; FINAL ASSEMBLY; G. NON-DESTRUCTIVE TESTING (NDT); LEAD-FREE SOLDER PASTE; MAIN EFFECT; PB FREE SOLDERS; PB-FREE; PRINTING PROCESS; RHEOLOGICAL PROPERTY; RHEOLOGICAL TEST; SOLDER PASTE; STENCIL PRINTING; THREE-LEVEL; TRANSFER EFFICIENCY; TRANSFER PATTERNS; ULTRA FINE PITCH;

LEAD; PLASTIC ADHESIVES; PRINTING; PRINTING PRESSES; RHEOLOGY; SOLDERING ALLOYS; SURFACE DEFECTS; SURFACE MOUNT TECHNOLOGY;

NONDESTRUCTIVE EXAMINATION;

EID: 79953163299     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.02.045     Document Type: Article

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