Correlating solder paste composition with stencil printing performance

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 304-312

  Nguty, T A ^a   Ekere, N N ^a   Adebayo, A ^a  

^a UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; CREEP; RHEOLOGY; SOLDERING; VISCOELASTICITY;

SOLDER PASTES; STENCIL PRINTING;

ELECTRONICS PACKAGING;

EID: 0033357740     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (26)