An investigation into the rheological properties of different lead-free solder pastes for surface mount applications

Soldering & Surface Mount Technology

Volumn 20, Issue 2, 2008, Pages 3-10

  Mallik, S ^a   Ekere, N N ^a   Marks, A E ^a   Durairaj, R ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b Universiti Tuanku Abdul Rahman   (Malaysia)

Author keywords

Creep; Lead; Rheological properties; Slip; Solder paste

Indexed keywords

CREEP; LEAD; MATHEMATICAL MODELS; RHEOLOGY; SOLDERING ALLOYS; VISCOELASTICITY;

RHEOLOGICAL PROPERTIES; SERRATED PARALLEL PLATES; SHEAR THINNING; SOLDER PASTES;

ADHESIVE PASTES;

EID: 42149168559     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910810871511     Document Type: Article

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