Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 27, Issue 2, 2004, Pages 125-132

  Pan, Jianbiao ^a   Tonkay, Gregory L ^b   Storer, Robert H ^b   Sallade, Ronald M ^c   Leandri, David J ^d  

^a CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

^b Lehigh University   (United States)

^c Cygnus Therapeutic Systems   (United States)

^d American Technical Ceramics   (United States)

Author keywords

Analysis of variance (ANOVA); Area ratio; Design of experiment; Solder paste; Stencil printing; Transfer ratio

Indexed keywords

ADHESIVE PASTES; COMPOSITION EFFECTS; DEPOSITION; ELECTRONICS PACKAGING; LASER APPLICATIONS; SOLDERING ALLOYS; STATISTICAL METHODS; THICKNESS MEASUREMENT;

ANALYSIS OF VARIANCE (ANOVA); AREA RATIO; BALL GRID ARRAY (BGA); DESIGN OF EXPERIMENT; QUAD FLAT PACKAGES (QFP); SOLDER PASTE STENCIL PRINTING; TRANSFER RATIO;

LITHOGRAPHY;

EID: 11244300764     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2004.837965     Document Type: Article

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