Modeling the fatigue life of solder joints for surface mount resistors

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 136-142

  Lu, H ^a   Bailey, C ^a   Dusek M ^b   Hunt, C ^b   Nottay, J ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FATIGUE OF MATERIALS; LABORATORIES; LEAD; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; RESISTORS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TIN;

LEAD-FREE SOLDER JOINT; MODELLING STUDIES; MODELLING TECHNIQUES; NATIONAL PHYSICAL LABORATORY; STRESS AND STRAIN; SURFACE MOUNT RESISTORS; THREE-DIMENSIONAL MODEL; TIN-LEAD SOLDERS;

LEAD-FREE SOLDERS;

EID: 84954212303     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904143     Document Type: Conference Paper

References (6)

1. Lau, J. H. "Surface Mount Solder Joints Under Thermal, Mechanical, and Vibration Conditions", The Mechanics of Solder Alloy Interconnects, Van Nostrand, New York, NY, 1995, pp 361-415
2. PHYSICA, V2.10. http://phvsica.gre.ac.uk
3. Taylor, G. A. " A Vertex Based Discretization Scheme Applied to Material Non-Linearity within a Multi-Physics Finite Volume Framework", Ph.D thesis, University of Greenwich, 1997
4. Frear, D., Morgan, H., Burchett, S. and Lau, J. (editors), The Mechanics of Solder Alloy interconnects. Chapman and Hall, New York, 1994, pp 323-324.
5. Darveaux, R. "Solder Joint Fatigue Life Model", Design and Reliability of Solders and Solder Interconnections, 1997, pp 213-218.
6. R. Darveaux and K. Banerji, Ball Grid Array Technology, 1995, McGraw-Hill, pp 379-442