Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 869-874

  Mallik, S ^a   Thieme, J ^b   Bauer, R ^b   Ekere, N N ^a   Seman, A ^a   Bhatti, R ^a   Durairaj, R ^c  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b UNIVERSITY OF APPLIED SCIENCES DRESDEN   (Germany)

^c UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERISATION; DESIGN AND DEVELOPMENT; ELECTRONIC ASSEMBLIES; ELECTRONIC PRODUCT; FLOW BEHAVIOURS; GOOD CORRELATIONS; HIGH SHEAR RATE; INTEGRAL PART; LEAD-FREE SOLDER PASTE; MINIATURISATION; NOVEL TECHNIQUES; PASTE FORMULATIONS; PASTE VISCOSITY; PRINTING PERFORMANCE; QUALITY MONITORING; RHEOLOGICAL BEHAVIOUR; RHEOLOGICAL PROPERTY; SHEAR RATES; SHEAR THINNING; SNAGCU SOLDER; SOLDER PASTE; SOLDER PASTE PRINTING; STENCIL PRINTING; THERMAL BONDING; VEHICLE SYSTEM;

ASSEMBLY; DEPOSITS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; LEAD; PRINTING; RHEOLOGY; SHEAR DEFORMATION; SILVER; TIN; VISCOSITY;

SOLDERING ALLOYS;

EID: 77950948847     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416423     Document Type: Conference Paper

References (12)

1. Mangin, C.H., "Where quality is lost on SMT boards", Circuits Assembly, February, (1991), pp. 63-64.
2. Okuru, T., Kanai, M., Ogata, S., Takei, T. and Takakusagi, H., "Optimisation of solder paste printability with laser inspection technique", Proc IEEE/CPMT International Electronics Manufacturing Symposium, 1993, pp. 57-161.
3. Bao, X., Lee, N., Raj, R. B., Rangan, K. P., Maria, A., "Engineering solder paste performance through controlled stress rheology analysis", Soldering & Surface Mount Technology, Vol.10 No.2,(1998), pp. 26-35.
4. Kolli, V. G., Gadala-Maria, F. and Anderson, R., (1997), "Rheolgical Characterisaiton of solder paste for surface mount applications", IEEE Trans CPMT-B, 20/4, (1997), pp 416-423.
5. Nguty, T. A., Ekere, N. N. and Adebayo, A., "Correlating solder paste composition with stencil printing performance", Proc IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, Texas, October 18-19, 1999, pp. 304-309.
6. Durairaj, R, Ekere, N. N. and Salam, B. , "Thixotropy flow behaviour of solder and conductive adhesive pastes", Journal of materials science: materials in electronics, 15, (2004), pp. 677-683.
7. Barnes, H. A., "Thixotropy - a review", Journal of nonnewtonian fluid mechanics, vol.70, (1997), pp. 1-33.
8. Pal, R., "Slippage during the flow of emulsions in rheometers", Colloids Surf A: Physciochem Eng Aspects, vol.162, (2000), pp.55-66.
9. Mallik, S, Ekere, N. N., Durairaj, R., Seman, A. and Marks, A. E., "Wall-slip Effects in SnAgCu Solder Pastes used in Electronics Assembly Applications", Materials & Design, vol.30, (2009), pp. 4502-4506.
10. Barnes, H. A., "A review of the slip (wall depletion) of polymer solutions, emulsions and particle suspensions in viscometer: its causes, character, and cure", J Non-Newtonian Fluid Mech, vol.56, (1995), pp. 221-251
11. Hwang, J. S., Solder Paste in Electronics Packaging, Van Nostrand Reinhold, 1989.
12. Mallik, S (2009), Study of the Time-dependent Rheological Behaviour of Lead-free Solder Pastes and Flux Mediums used for Flip-Chip Assembly Applications, Ph.D. Thesis, 2009, University of Greenwich.