A study of solder paste release from small stencil apertures of different geometries with constant volumes

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2002, Pages 159-165

  Aravamudhan, Srinivasa ^a   Santos, Daryl ^a   Pham Van Diep, Gerald ^a   Andres, Frank ^b  

^a State University of New York   (United States)

^b Equipment Group ^*  (United States)

Author keywords

CSP; Fine feature; Flip chips; Square vs. circle; Stencil printing

Indexed keywords

CHIP SCALE PACKAGES; DEFECTS; FLIP CHIP DEVICES; PARTICLE SIZE ANALYSIS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS;

SOLDER PASTE; STENCIL PRINTING;

SURFACE MOUNT TECHNOLOGY;

EID: 0036397180     PISSN: 10898190     EISSN: None     Source Type: Journal    
DOI: 10.1109/IEMT.2002.1032744     Document Type: Article

References (10)

1. Clouthier, R., "SMT Printing Process for Fine Pitch and Ultrafine Pitch", Proceedings of Surface Mount International Conference, August 1997, pp. 674-683.
2. Partridge, J., and Gunn, R., "Paste Printing and Characterization for Chip Scale Package Assemblies", Proceeding of Surface Mount International Conference, San Jose, California, August 1998, pp. 405-416.
3. Clech, J., "Flip-Chip/CSP Assembly Reliability and Solder Volume Effects", Proceeding of Surface Mount International Conference, August 1997, pp. 315-324.
4. Rodriguez, G., and Baldwin, D., "Analysis of Solder Paste Release in Fine Pitch Stencil Printing Process", ASME Transactions Journal of Electronics Packaging, Vol. 121, September 1999.
5. Kennedy, J., and Ros, J., "Solder Paste Printing Requirements for CSP Packages", Proceedings of SMTA International, September-October 1999, pp. 105-115.
6. Kelley, R., and Tan, D., "A 3-D Solder Paste Inspection Strategy for CSPs and 0201s", http://www.gsilumonics.com/electronics/pdfs/spi_3d.pdf, 2001.
7. Burr, D., "Printing Guideline for BGA and CSP Assemblies", SMI Proceedings-Conference, San Jose Convention Center, San Jose, California, August 1998, pp. 417-424.
8. Painaik, M., Santos, D., and McLenaghan, J., "Guideline for Fine Feature Stencil Printing", Proceedings of SMTA International, September-October 2001, pp. 39-48.
9. Coleman, W., "Paste Release vs. Print Area Ratio", Proceeding of APEX 2001, January 2001, pp. MP2-2 1-8.
10. Chouta. P., and Fleck, I., "A New Dimension in Stencil Design", APEX 2002 Presentation, January 2002.