Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Materials and Design

Volumn 30, Issue 9, 2009, Pages 3812-3818

  Durairaj, R ^a   Ramesh, S ^a   Mallik, S ^b   Seman, A ^b   Ekere, N ^b  

^a UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Lead free solder paste; Rheology; Stencil printing

Indexed keywords

CHARACTERISATION; DENSE SUSPENSION; ELECTRONIC MANUFACTURING INDUSTRY; FLOW BEHAVIOURS; LEAD-FREE PASTES; LEAD-FREE SOLDER PASTE; PHASE ANGLES; PRINTING PERFORMANCE; RHEOLOGICAL BEHAVIOUR; RHEOLOGICAL MEASUREMENTS; SOLDER PASTE; STENCIL PRINTING; SWEEP TESTS; VISCO-ELASTIC;

BRAZING; CEMENTS; ELASTICITY; LIQUIDS; PLASTICITY; PRINTING; PRINTING PRESSES; RHEOLOGY; VISCOSITY; WELDING;

LEAD;

EID: 67349116321     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2009.01.028     Document Type: Article

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