Viscoelastic properties of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2008, Pages

  Durairaj, R ^a   Mallik, S ^b   Seman, A ^b   Marks, A ^b   Ekere, N N ^b  

^a UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BREAK DOWN; FLIP CHIP; FLIP CHIP ASSEMBLIES; FLOW CURVES; ISOTROPIC CONDUCTIVE ADHESIVES; LOSS MODULI; MEASURED PARAMETERS; PASTE FORMULATIONS; PASTE PRINTING PROCESS; PRINTING PERFORMANCE; PRINTING PROCESS; RHEOLOGICAL MEASUREMENTS; SOLDER PASTE; SOLDER PASTE PRINTING; STENCIL PRINTING; STORAGE MODULI; STRESS RANGE; STRESS TEST; STRESS/STRAIN; VISCO-ELASTIC; VISCOELASTIC PROPERTIES; VISCOUS PROPERTIES;

CEMENTS; CHIP SCALE PACKAGES; DEFECTS; DEFORMATION; ELASTIC MODULI; ELASTICITY; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTING; PRINTING PRESSES; RHEOLOGY; STRESS ANALYSIS; VISCOSITY;

ADHESIVE PASTES;

EID: 77955119113     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507801     Document Type: Conference Paper

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