Microscopic study of a ligand induced electroless plating process onto polymers

ACS Applied Materials and Interfaces

Volumn 2, Issue 11, 2010, Pages 3043-3051

  Garcia, Alexandre ^a,b   Berthelot, Thomas ^a   Viel, Pascal ^b   Polesel Maris, Jérôme ^b   Palacin, Serge ^b  

^a DIF   (France)

^b CNRS UMR 3299   (France)

Author keywords

ABS; ABS PC; adhesion; electrical properties; metallization; polyamide and diazonium salts; polymer electroless plating

Indexed keywords

ABS; ABS-PC; ACRYLONITRILE-BUTADIENE-STYRENE; ADHESION STRENGTHS; AS-LIGANDS; BULK POLYMER; CARBOXYLATE GROUPS; CHROMIC ACID; COPPER FILMS; COPPER IONS; COVALENT GRAFTING; DEPOSITED LAYER; DIAZONIUM SALTS; ELECTRICAL PROPERTY; ELECTROLESS PLATING PROCESS; FOUR-POINT PROBE; GENERIC PROCESS; ION EXCHANGE PROPERTIES; MACROSCOPIC PROPERTIES; METALLIC LAYERS; METALLIC SALTS; METALLIZATIONS; MICROSCOPIC CHARACTERIZATION; MICROSCOPIC STUDY; PEEL ADHESION STRENGTH; PLATING PROCESS; POLYACRYLIC ACIDS; POLYMER SUBSTRATE; PRISTINE POLYMERS; SCANNING TUNNELING MICROSCOPY (STM); SCOTCH TAPE TEST; SEED LAYER; SEM; THIN LAYERS;

ACRYLICS; ADHESION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BOND STRENGTH (MATERIALS); BUTADIENE; CARBOXYLATION; CARBOXYLIC ACIDS; COPPER COMPOUNDS; ELECTRIC PROPERTIES; ELECTROLESS PLATING; ION EXCHANGE; LIGANDS; METAL IONS; METALLIZING; ORGANIC ACIDS; PALLADIUM; POLYMER FILMS; POLYMERS; SALTS; SCANNING ELECTRON MICROSCOPY; SCANNING TUNNELING MICROSCOPY; STYRENE; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

ABS RESINS;

EID: 79151477547     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am100907j     Document Type: Article

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