Silane-bridged electroless Ni-plating on submicron polymer spheres

Polymer Journal

Volumn 41, Issue 8, 2009, Pages 634-642

  Liaw, Wen Chang ^a   Huang, Po Chen ^a   Chen, Kuan Pin ^a   Chen, Chee Shan ^b  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b CHAOYANG UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

Core shell structure; Electroless plating; Ni plating; Silane coupling agent; Submicron polymer sphere

Indexed keywords

COOH GROUP; CORE-SHELL STRUCTURE; CROSSLINKED; DIMENSIONAL NETWORK; ELECTROLESS NI; EMULSIFIER-FREE EMULSION POLYMERIZATION; FUNCTIONALIZED; MECHANICAL AND ELECTRICAL PROPERTIES; METAL COATINGS; METAL SHELL; NI PLATING; POLYMER SPHERES; SILANE COUPLING AGENT; SILYL GROUP; SUB-MICRON POLYMERS; SUBMICRON POLYMER SPHERE; UNIFORM DISTRIBUTION;

BALL MILLING; BALL MILLS; COUPLING AGENTS; ELECTRIC PROPERTIES; ELECTROLESS PLATING; EMULSIFICATION; EMULSION POLYMERIZATION; MECHANICAL PROPERTIES; METALLIC FILMS; METALS; NICKEL; PLASTIC COATINGS; POLYMERS; POLYSTYRENES; PROTECTIVE COATINGS; SHELLS (STRUCTURES); SILANES; SILICON; SPHERES;

FUNCTIONAL POLYMERS;

EID: 70349669286     PISSN: 00323896     EISSN: 13490540     Source Type: Journal    
DOI: 10.1295/polymj.PJ2008334     Document Type: Article

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