Modified nernst equation for electroless metal deposition

Progress in Reaction Kinetics and Mechanism

Volumn 31, Issue 1, 2006, Pages 45-58

  Dimitrov, Vasili ^a   Gorker, Lev ^b  

^a TEL AVIV UNIVERSITY   (Israel)

^b Raicol Crystal Ltd   (Israel)

Author keywords

Copper plating; Dynamic Electrical Double Layer (DEDL); Electroless; Nernst potential

Indexed keywords

CATALYSIS; COPPER PLATING; ELECTROLYTIC REDUCTION; MATHEMATICAL MODELS; OSCILLATIONS;

CURRENT ELECTROLYTE; DYNAMIC ELECTRICAL DOUBLE LAYER (DEDL); ELECTROLESS METAL DEPOSITION; NERNST POTENTIAL;

ELECTROCHEMISTRY;

EID: 33846207558     PISSN: 14686783     EISSN: None     Source Type: Journal    
DOI: 10.3184/007967406779133957     Document Type: Article

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