Optimization and kinetics of electroless Ni-P-B plating of quartz optical fiber

Optical Materials

Volumn 31, Issue 10, 2009, Pages 1532-1539

  Jiang, Boquan ^a   Xiao, Lin ^a   Hu, Shufen ^a   Peng, Jian ^a   Zhang, Hua ^a   Wang, Minwei ^a  

^a NANCHANG UNIVERSITY   (China)

Author keywords

Coatings; Electroless plating; Ni based alloys; Optical fiber; Optical materials

Indexed keywords

ADHESION; ATOMIC EMISSION SPECTROSCOPY; CADMIUM COMPOUNDS; CHLORINE COMPOUNDS; COATINGS; DEPOSITION RATES; ELECTROLESS PLATING; GRAVIMETRIC ANALYSIS; INDUCTIVELY COUPLED PLASMA; NICKEL ALLOYS; NICKEL COATINGS; OPTICAL FIBERS; OPTICAL MATERIALS; POTASSIUM CHLORIDE; POTASSIUM COMPOUNDS; QUARTZ; SCANNING ELECTRON MICROSCOPY; SODIUM BOROHYDRIDE; SULFUR COMPOUNDS; SURFACE ROUGHNESS;

ELECTROLESS PLATING METHODS; EXPERIMENTAL VERIFICATION; INDUCTIVELY COUPLED PLASMA ATOMIC EMISSION SPECTROSCOPY; LOW SURFACE ROUGHNESS; MORPHOLOGY AND STRUCTURES; NI BASED ALLOY; ORTHOGONAL EXPERIMENT; X RAY DIFFRACTOMETERS;

NICKEL COMPOUNDS;

EID: 67650921139     PISSN: 09253467     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optmat.2009.02.016     Document Type: Article

References (25)

1. Shiue S.T., Lien P.T., and He J.L. Journal of Applied Physics 87 (2000) 3759
2. Shiue S.T., Pan L.Y., and Hsiao H.H. Materials Chemistry and Physics 78 (2003) 518
3. Shiue S.T., He J.L., Pan L.Y., and Huang S.T. Thin Solid Films 406 (2002) 210
4. Kwok K.H., and Chiu W.K.S. Carbon 41 (2003) 673
5. Yan H., Xu N., Huang W.-Y., Han H.-M., and Xiao S.-J. Electroless plating of silver nanoparticles on porous silicon for laser desorption/ionization mass spectrometry. International Journal of Mass Spectrometry 281 (2009) 1
6. Lee C.K. Structure, electrochemical and wear-corrosion properties of electroless nickel-phosphorus deposition on CFRP composites. Materials Chemistry and Physics 114 (2009) 125
7. Shibata A., Imamura Y., Sone M., Ishiyama C., and Higo Y. Pd-Ni-P metallic glass film fabricated by electroless alloy plating. Thin Solid Films 517 (2009) 1935
8. 2 separation. Journal of Natural Gas Chemistry 17 (2008) 321
9. Zhang F., He D., Ge S., and Cai Q. Effect of fiber splitting on the catalytic graphitization of electroless Ni-B-coated polyacrylonitrile-based carbon fibers. Surface and Coatings Technology 203 (2008) 99
10. Yoon J.-W., Koo J.-M., Kim J.-W., Ha S.-S., Noh B.-I., Lee C.-Y., Park J.-H., Shur C.-C., and Jung S.-B. Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder. Journal of Alloys and Compounds 466 (2008) 73
11. Yuen C.W.M., Jiang S.Q., Kan C.W., and Tung W.S. Influence of surface treatment on the electroless nickel plating of textile fabric. Applied Surface Science 253 (2007) 5250
12. Huang Y., Shi K., Liao Z., Wang Y., Wang L., and Zhu F. Studies of electroless Ni-Co-P ternary alloy on glass fibers. Materials Letters 61 (2007) 1742
13. Liu W.L., Chen W.J., Tsai T.K., Hsieh S.H., and Chang S.Y. Effect of nickel on the initial growth behavior of electroless Ni-Co-P alloy on silicon substrate. Applied Surface Science 253 (2007) 3843
14. Wu S.-S., Liu W.-L., Tsai T.-K., Hsieh S.-H., and Chen W.-J. Growth behavior of electroless copper on silicon substrate. Journal of University of Science and Technology Beijing 14 (2007) 7
15. Filas, Robert William, Jankoski, US Patent No. 0 623 565 A1, 09 November, 1994.
16. Meijiao Sara Chen, Annapolis, US Patent No. 6251,252 BI, 26 Junuary, 2001.
17. Miller, Michael, Nnevin, US, US International Patent Classification: C23C 18/00, WO 02/36852 A2, 20 February, 2001.
18. John Grunwald, Tel Aviv, US, US 2003/0173226 A1, 18 September, 2003.
19. Timothy J. Peret, Rutlant, Methods of Metallizing Non-Conductive Substrates and Metallized Non-Conductive Substrates Formed Thereby, US, US 2005/014830 A1, 30 June, 2005.
20. Shiue S.-T., and Yang C.-H. Thin Solid Films 485 (2005) 169
21. Li X.-p., Jiang D.-s., Yu H.-h., Yu D.-s., Yang E.-y., and Li H.-h. Journal of Chemical Industry and Engineering 1 (2005) 126 (in Chenese)
22. An M. Theory and Technology of Electroplating [M] (2004), Haerbin Industrial University Press, Haerbin, China p. 269
23. Wang Z., and Zhou Y. Physical Chemistry [M] (2007), Beijing, Higher Education Press, China p. 273
24. Li N., and Tu Z. Practical Technology of Electroless Plating [M] (2003), Chemical Industry Publishing House, Beijing, China
25. Ban C., Zhang L., Zhang L., and Chen L. Study on Thermodynamics and Kinetics of Electroless Ni-P Plating. Journal of Shenyang University of Technology 22 (2000) 119 (in Chinese)