Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex

Surface and Coatings Technology

Volumn 202, Issue 9, 2008, Pages 1581-1587

  Bicak, Niyazi ^a   Karagoz, Bunyamin ^a  

^a ISTANBUL TECHNICAL UNIVERSITY   (Turkey)

Author keywords

Chlorosulfonation; Copper deposition; Electroless copper plating; Polystyrene; Sulfonylhydrazide

Indexed keywords

COPPER PLATING; POLYSTYRENES; SCANNING ELECTRON MICROSCOPY; SPECTROMETRY; SULFONATION; X RAY PHOTOELECTRON SPECTROSCOPY;

CHLOROSULFONATION; COPPER DEPOSITION; ELECTROLESS COPPER PLATING; SULFONYLHYDRAZIDE; X-RAY PHOTOELECTRON SPECTROMETRY (XPS);

ELECTROLESS PLATING;

COPPER PLATING; ELECTROLESS PLATING; POLYSTYRENES; SCANNING ELECTRON MICROSCOPY; SPECTROMETRY; SULFONATION; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 37349011919     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.06.040     Document Type: Article

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