Selective electroless copper deposition on self-assembled dithiol monolayers

ACS Applied Materials and Interfaces

Volumn 1, Issue 3, 2009, Pages 584-589

  Aldakov, Dmitry ^a   Bonnassieux, Yvan ^a   Geffroy, Bernard ^a   Palacin, Serge ^b  

^a LABORATOIRE DE PHYSIQUE DES INTERFACES ET DES COUCHES MINCES   (France)

^b CNRS UMR 3299   (France)

Author keywords

copper vias; dithiols; electroless deposition; microcontact printing; palladium nanoparticles; self assembled monolayers

Indexed keywords

ASSEMBLY PROCESS; DITHIOLS; ELECTROLESS COPPER DEPOSITION; ELECTROLESS DEPOSITION; ELECTROLESS METALLIZATION; GOLD SUBSTRATES; HIGH RESOLUTION; METALLIZATIONS; MICROCONTACT PRINTING; PALLADIUM NANOPARTICLES; SELF-ASSEMBLED;

CATALYSTS; COPPER; COPPER DEPOSITS; ELECTROLESS PLATING; ELECTRON DEVICE MANUFACTURE; ELECTRON ENERGY LEVELS; GOLD COATINGS; GOLD DEPOSITS; METALLIZING; NANOPARTICLES; PRINTING; X RAY PHOTOELECTRON SPECTROSCOPY;

SELF ASSEMBLED MONOLAYERS;

EID: 72449150342     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am8001346     Document Type: Article

References (47)

1. Schlesinger, M. and Paunovic, M. Modern Electroplating, 4th ed.; Wiley: New York, 2000.
2. Zabetakis, D. and Dressick, W. J. ACS Appl. Mater. Interfaces 2009, in press (DOI: 10.1021/am800121d).
3. Rao, C. R. K. and Trivedi, D. C. Coord. Chem. Rev. 2005, 249, 613-631
4. Michel, B., Bernard, A., Bietsch, A., Delamarche, E., Geissler, M., Juncker, D., Kind, H., Renault, J.-P., Rothuizen, H., Schmid, H., Schmidt-Winkel, P., Stutz, R., and Wolf, H. J. IBM Res. Dev. 2001, 45, 697
5. Shacham-Diamand, Y., Dubin, V., and Angyal, M. Thin Solid Films 1995, 262, 93-103
6. Brenner, A. and Riddell, G. E. J. Res. Natl. Bur. Stand. 1946, 37, 31-34
7. Lacourcelle, L. Traité de galvanotechnique; Galva-conseil: Millau, France, 1997.
8. Ishida, M., Kasuga, M., Kaneko, T., and Shimoda, T. Jpn. J. Appl. Phys. 2000, 39, L227-L229
9. Zhu, P., Masuda, Y., and Koumoto, K. J. Mater. Chem. 2004, 14, 976-981
10. Chen, M.-S., Brandow, S. L., Dulcey, C. S., Dressick, W. J., Taylor, G. N., Bohland, J. F., Georger, J. H., Jr., Pavelchek, E. K., and Calvert, J. M. J. Electrochem. Soc. 1999, 146, 1421-1430
11. Dressick, W. J., Dulcey, C. S., Georger, J. H., Jr., and Calvert, J. M. Chem. Mater. 1993, 5, 148-150
12. Glickman, E., Inberg, A., Fishelson, N., and Shaham-Diamand, Y. Microelectron. Eng. 2007, 84, 2466-2470
13. Xu, D., Kang, E. T., Neoh, K. G., Zhang, Y., Tay, A. A. O., Ang, S. S., Lo, M. C. Y., and Vaidyanathan, K. J. Phys. Chem. B 2002, 106, 12508-12516
14. Sawada, S., Masuda, Y., Zhu, P., and Koumoto, K. Langmuir 2006, 22, 332-337
15. Zangmeister, C. D. and van Zee, R. D. Langmuir 2003, 19, 8065-8068
16. Garno, J. C., Zangmeister, C. D., and Batteas, J. D. Langmuir 2007, 23, 7874-7879
17. Lu, P. and Walker, A. V. Langmuir 2007, 23, 12577-12582
18. Sugihara, S., Iwasawa, A., Onose, K., and Yamaki, J. J. Appl. Electrochem. 1996, 26, 63-71
19. Kind, H., Geissler, M., Schmid, M., Michel, B., Kern, K., and Delamarche, E. Langmuir 2000, 16, 6367-6373
20. Lee, I., Hammond, P. T., and Rubner, M. F. Chem. Mater. 2003, 15, 4583-4589
21. Nottbohm, C. T., Turchanin, A., and Gölzhäuser, A. Z. Phys. Chem. 2008, 222, 917-926
22. Ulman, A. Chem. Rev. 1996, 96, 1533-1554
23. de Boer, B., Meng, H., Perepichka, D. F., Zheng, J., Frank, M. M., Chabal, Y. J., and Bao, Z. Langmuir 2003, 19, 4272-4284
24. Love, J. C., Estroff, L. A., Kriebel, J. K., Nuzzo, R. G., and Whitesides, G. M. Chem. Rev. 2005, 105, 1103-1169
25. Nakanishi, T., Ohtani, B., and Uosaki, K. J. Phys. Chem. B 1998, 102, 1571-1577
26. Bain, C. D., Troughton, E. B., Tao, Y. T., Evall, J., Whitesides, G. M., and Nuzzo, R. G. J. Am. Chem. Soc. 1989, 111, 321-335
27. Obeng, Y. S., Laing, M. E., Friedli, A. C., Yang, H. C., Wang, D., Thulstrup, E. W., Bard, A. J., and Michl, J. J. Am. Chem. Soc. 1992, 114, 9943-9952
28. Engelkes, V. B., Beebe, J. M., and Frisbie, C. D. J. Am. Chem. Soc. 2004, 126, 14287-14296
29. Lindsay, S. M. and Ratner, M. A. Adv. Mater. 2007, 19, 23-31
30. Colvin, V. L., Goldstein, A. N., and Alivisatos, A. P. J. Am. Chem. Soc. 1992, 114, 5221-5230
31. Ogawa, S., Hu, K., Fan, F.-R. F., and Bard, A. J. J. Phys. Chem. B 1997, 101, 5707-5711
32. Aliganga, A. K. A., Duwez, A.-S., and Mittler, S. Org. Electron. 2006, 7, 337-350
33. Porter, M. D., Bright, T. B., Allara, D. L., and Chidsey, C. E. D. J. Am. Chem. Soc. 1987, 109, 3559-3568
34. Dubois, L. H. and Nuzzo, R. G. Annu. Rev. Phys. Chem. 1992, 43, 437-463
35. Colavita, P. E., Miney, P. G., Taylor, L., Priore, R., Pearson, D. L., Ratliff, J., Ma, S., Ozturk, O., Chen, D. A., and Myrick, M. L. Langmuir 2005, 21, 12268-12277
36. Henderson, J. J., Feng, S., Ferrence, G. M., Bein, T., and Kubiak, C. P. Inorg. Chim. Acta 1996, 242, 115-124
37. Rieley, H., Kendall, G. K., Zemicael, F. W., Smith, T. L., and Yang, S. Langmuir 1998, 14, 5147-5153
38. Rajalingam, K., Strunskus, T., Terfort, A., Fischer, R. A., and Woll, C. Langmuir 2008, 24, 7986-7994
39. Gniewek, A., Trzeciak, A. M., Ziókowski, J. J., Kèpiñski, L., Wrzyszcz, J., and Tylus, W. J. Catal. 2005, 229, 332-343
40. Xu, L., Liao, J., Huang, L., Ou, D., Guo, Z., Zhang, H., Ge, C., Gu, N., and Liu, J. Thin Solid Films 2003, 434, 121-125
41. Lin, Y.-M. and Yen, S.-C. Appl. Surf. Sci. 2001, 178, 116-126
42. Patterson, J. C., Ni Dheasuna, C., Barrett, J., Spalding, T. R., OReilly, M., Jiang, X., and Crean, G. M. Appl. Surf. Sci. 1995, 91, 124-128
43. Lau, P. P., Wong, C. C., Chan, L., See, A., and Law, S. B. J. Electrochem. Soc. 2004, 151, C436-C438
44. Xia, Y. and Whitesides, G. Angew. Chem., Int. Ed. 1998, 37, 550-575
45. Kumar, A., Biebuyck, H. A., and Whitesides, G. Langmuir 1994, 10, 1498-1511
46. Hidber, P. C., Helbig, W., Kim, E., and Whitesides, G. M. Langmuir 1996, 12, 1375-1380
47. Loo, Y.-L., Lang, D. V., Rogers, J. A., and Hsu, J. W. P. Nano Lett. 2003, 3, 913-917