Effect of Pd ions in the chemical etching solution

Journal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)

Volumn 14, Issue 3, 2007, Pages 286-289

  Wang, Guixiang ^a,b   Li, Ning ^a   Li, Deyu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b HARBIN ENGINEERING UNIVERSITY   (China)

Author keywords

ABS plastic; AFM; etching; palladium; XPS

Indexed keywords

ATOMIC FORCE MICROSCOPY; ETCHING; PALLADIUM; SULFURIC ACID; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHROMIC ACID; ETCHING SOLUTION; PD/SN CATALYST;

ABS RESINS;

EID: 34250734520     PISSN: 10058850     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-8850(07)60055-3     Document Type: Article

References (13)

1. Wu X.G. Technology of Plastics Plating (1983), Sichuan Technology Press, Chengdu 55 (in Chinese)
2. Chen Y., and Miao Y. New process for direct plating on plastics. Mater. Prot. 30 (1997) 15 (in Chinese)
3. Sam S., Alfons V., Andre V.C., et al. Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer. Appl. Surf. Sci. 237 (2004) 456
4. Zheng Y.S., Guo Q., Su Y.J., et al. Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectron, J. 34 (2003) 109
5. Li W.T., Chartersb R.B., Daviesa L., et al. Significant improvement of adhesion between gold thin films and a polymer. Appl. Surf. Sci. 233 (2004) 227
6. Yamauchia T., Rabmany A.E., Mineyama D., et al. Surface layer in CR-39 plastic track detector where the bulk etch rate is enhanced. Radiat. Meas. 37 (2003) 119
7. Molitor P., Barron V., and Young T. Surface treatment of titanium for adhesive bonding to polymer composites: a review. Int. J. Adhes. Adhes. 21 (2001) 129
8. Gosa'Ivez M.A., Foster A.S., and Nieminen R.M. Atomistic simulations of surface coverage effects in anisotropic wet chemical etching of crystalline silicon. Appl. Surf. Sci. 202 (2002) 160
9. D.A. Radovsky, F. Poughkeepale, and B.J. Ronkese. Method of Electroplating on a Dielectric Base, US 3099608, 1963.
10. Ono S., Naitoh K., and Osaka T. Initial propagation stage of direct copper plating on non-conducting substrates. Electrochim. Acta. 44 (1999) 3697
11. Hanna F., Hamid Z.A., and Aal A.A. Controlling factors affecting the stability and rate of electroless copper plating. Mater. Lett. 58 (2003) 104
12. Xu C.L., Wu G.W., and Liu Z. Preparation of copper nanoparticles on carbon nanotubes by electroless plating method. Mater. Res. Bull. 39 (2004) 1499
13. J. Okada, M. Imamura, K. Satoh, et al., Process for plating on ABS resin using of electroless copper plating solution using saccharides as reducing agent, [in] AESF. Sur/fin Conference, New York, 2004, p.125.