Hierarchical life prediction model for actively cooled LED-based luminaire

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 4, 2010, Pages 728-737

  Song, Bong Min ^a   Han, Bongtae ^a   Bar Cohen, Avram ^a   Sharma, Rajdeep ^b   Arik, Mehmet ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

Active cooling; junction temperature; LED based luminaire; light emitting diode (LED); synthetic jet

Indexed keywords

ACTIVE COOLING; JUNCTION TEMPERATURES; LED-BASED LUMINAIRE; LIGHT-EMITTING DIODE (LED); SYNTHETIC JETS;

COOLING; DEGRADATION; DIODES; HIERARCHICAL SYSTEMS; INCANDESCENT LAMPS; JETS; LIGHT EMISSION; MATHEMATICAL MODELS;

LIGHT EMITTING DIODES;

EID: 78651069924     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2010.2051034     Document Type: Article

References (43)

1. M. Arik and A. Setlur, "Energy efficient solid state lighting and thermal management for a sustainable future," in Proc. Global Conf. Global Warming, 2008.
2. E. F. Schubert, Light-Emitting Diodes, 2nd ed. New York: Cambridge University Press, 2006.
3. U.S. Department of Energy, "Residential recessed downlights," in Energy Efficiency and Renewable Energy (LED Application Series). 2008.
4. M. Arik and S. Weaver, "Effect of chip and bonding defects on the junction temperatures of high-brightness light-emitting diodes," Opt. Eng., vol. 44, no. 11, p. 111305-8, 2005.
5. U.S. Department of Energy, "Luminaire efficacy," in Energy Efficiency and Renewable Energy (LED Application Series). 2008.
6. C. H. Liu, R. W. Chuang, S. J. Chang, Y. K. Su, L. W. Wu, and C. C. Lin, "Improved light output power of InGaN/GaN MQW LEDs by lower temperature p-GaN rough surface," Mater. Sci. Eng. B Solid State Mater. Adv. Technol., vol. 112, no. 1, pp. 10-13, Sep. 2004.
7. W. C. Peng and Y. C. S. Wu, "Improved luminance intensity of InGaN-GaN light-emitting diode by roughening both the p-GaN surface and the undoped-GaN surface," Appl. Phys. Lett., vol. 89, no. 4, p. 041116, 2006.
8. T. Fujii, Y. Gao, R. Sharma, E. L. Hu, S. P. Denbaars, and S. Nakamura, "Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening," Appl. Phys. Lett., vol. 84, no. 6, pp. 855-857, 2004.
9. G. Rong-Feng, T. Da-Lei, W. Xing, and Z. Wen-Qing, "Thermal, mechanical and optical analysis of SiC-based LED," in Proc. 10th Conf. Electron. Packag. Technol., 2008, pp. 939-944.
10. H.-H. Kim, S.-H. Choi, S.-H. Shin, Y.-K. Leea, S.-M. Choia, and S. Yia, "Thermal transient characteristics of die attach in high power LED PKG," Microelectron. Reliab., vol. 48, no. 3, pp. 445-454, Mar. 2008.
11. M. Arik, C. A. Becker, S. E. Weaver, and J. Petroski, "Thermal management of LEDs: Package to system," in Proc. 3rd Int. Conf. Solid State Lighting, 2004, pp. 64-75.
12. J. P. You, Y. He, and F. G. Shi, "Thermal management of high power LEDs: Impact of die attach materials," in Proc. Int. Conf. Microsyst. Packag. Assembly Circuits Technol., 2007, pp. 239-242.
13. L. Yang, J. Hu, S. Jang, and M. W. Shin, "Thermal design of ceramic packages for high power light-emitting diodes," Semiconductor Sci. Technol., vol. 22, no. 7, pp. 705-708, Jul. 2007. (Pubitemid 47133825)
14. M. Arik, J. Petroski, and S. Weaver, "Thermal challenges in the future generation solid state lighting applications: Light emitting diodes," in Proc. Intersoc. Conf. Thermal Phenomena, 2002, pp. 113-120.
15. H. Jianzheng, Y. Lianqiao, and S. Moo Whan, "Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages," in Proc. 13th Int. Workshop Thermal Investigation ICs Syst., 2007, pp. 77-81.
16. J. Hu, L. Yang, and M. W. Shin, "Thermal and mechanical analysis of high-power LEDs with ceramic packages," IEEE Trans. Device Mater. Reliab., vol. 8, no. 2, pp. 297-303, Jun. 2008.
17. L. Yuan, S. Liu, M. Chen, and X. Luo, "Thermal analysis of high power LED array packaging with microchannel cooler," in Proc. 7th Int. Conf. Electron. Packag. Technol., Aug. 2006, pp. 1-5.
18. L. Yang, S. Jang, W. Hwang, and M. Shin, "Thermal analysis of high power GaN-based LEDs with ceramic package," Thermochim. Acta, vol. 455, nos. 1-2, pp. 95-99, Apr. 2007.
19. T. H. Lee, L. Kim, W. J. Hwang, C. C. Lee, and M. W. Shin, "Thermal analysis of GaN-based LEDs using the finite element method and unit temperature profile approach," Physica Status Solidi (b), vol. 241, no. 12, pp. 2681-2684, 2004.
20. M. Arik, "Local heat transfer coefficient of a high frequency synthetic jets during impingement cooling over flat surfaces," Heat Transfer Eng., vol. 29, no. 9, pp. 763-773, 2008.
21. J. Petroski, M. Arik, and M. Gursoy, "Piezoelectric fans: Heat transfer enhancements for electronics cooling," in Proc. Conf. ASME-JSME Thermal Eng. Summer Heat Transfer, 2008, pp. 671-677.
22. X. B. Luo and S. Liu, "A microjet array cooling system for thermal management of high-brightness LEDs," IEEE Trans. Adv. Packag., vol. 30, no. 3, pp. 475-484, 2007.
23. X. Luo, W. Chen, R. Sun, and S. Liu, "Experimental and numerical investigation of a microjet-based cooling system for high power LEDs," Heat Transfer Eng., vol. 29, no. 9, pp. 774-781, 2008.
24. S. Ishizaki, H. Kimura, and M. Sugimoto, "Lifetime estimation of high power white LEDs," J. Light Visual Environment, vol. 31, no. 1, pp. 11-18, 2007.
25. N. Narendran, Y. Gu, J. P. Freyssinier, H. Yu, and L. Deng, "Solid-state lighting: Failure analysis of white LEDs," J. Cryst. Growth, vol. 268, nos. 3-4, pp. 449-456, 2004.
26. Y. Gu, N. Narendran, and J. P. Freyssinier, "White LED performance," in Proc. 4th Int. Conf. Solid State Lighting, 2004, pp. 119-124.
27. M. Arik, "An investigation into feasibility of impingement heat transfer and acoustic abatement of meso scale synthetic jets," Appl. Thermal Eng., vol. 27, nos. 8-9, pp. 1483-1494, 2007.
28. J. Garg, M. Arik, S. Weaver, T. Wetzel, and S. Saddoughi, "Advanced localized air cooling with synthetic jet," ASME J. Electron. Packag., vol. 127, pp. 503-511, 2005.
29. Y. Utturkar, M. Arik, and T. Icoz, "Thermal characteristics of a synthetic jet integrated heat sink design for air-cooled electronics," in Proc. ASME Interpack Conf. IPACK 89109, 2009.
30. M. Arik, Y. Utturkar, and M. Ozmusul, "Effect of synthetic jets over a natural convection heat sink," in Proc. ASME Int. Mech. Eng. Congr. Expo., 2008, pp. 511-517.
31. N. C. Chen, Y. N. Wang, C. Y. Tseng, and Y. K. Yang, "Determination of junction temperature in AlGaInP/GaAs light emitting diodes by self-excited photoluminescence signal," Appl. Phys. Lett., vol. 89, no. 10, p. 3, Sep. 2006.
32. Y. Xi and E. F. Schubert, "Junction-temperature measurement in GaN ultraviolet light-emitting diodes using diode forward voltage method," Appl. Phys. Lett., vol. 85, no. 12, pp. 2163-2165, 2004.
33. Y. Xi, J. Q. Xi, T. Gessmann, J. M. Shah, J. K. Kim, E. F. Schubert, A. J. Fischer, M. H. Crawford, K. H. A. Bogart, and A. A. Allerman, "Junction and carrier temperature measurements in deep-ultraviolet light-emitting diodes using three different methods," Appl. Phys. Lett., vol. 86, no. 3, p. 031907, 2005.
34. R. G. Polcawich, C.-N. Feng, S. Kurtz, S. Perini, P. J. Moses, and S. Trolier-McKinstry, "AC and DC electrical stress reliability of piezoelectric lead zirconate titanate (PZT) thin films," Int. J. Microcircuits Electron. Packag., vol. 23, no. 1, pp. 85-91, 2000.
35. Y. Zhang, X. Cheng, and R. Qian, "Fatigue behavior of ferroelectric ceramics under mechanically-electrically coupled cyclic loads," Mater. Sci. Eng. A, vol. 351, nos. 1-2, pp. 81-85, Jun. 2003.
36. S. Sherrit, R. B. Stimpson, H. D. Wiederick, and B. K. Mukherjee, "Stress and temperature dependence of the direct piezoelectric charge coefficient in lead zirconate titanate ceramics," in Proc. Conf. Smart Mater. Structures MEMS, 1997, pp. 74-81.
37. D. C. Lupascu, Fatigue in Ferroelectric Ceramics and Related Issues. Berlin, Germany: Springer, 2004.
38. G. Yang, S.-F. Liu, W. Ren, and B. K. Mukherjee, "Uniaxial stress dependence of the piezoelectric properties of lead zirconate titanate ceramics," in Proc. Smart Structures Mater., 2000, pp. 103-113
39. A. V. Carazo, "Novel piezoelectric transducers for high voltage measurements," Ph.D. dissertation, Dept. Electr. Eng., Univ. Politecn. Catalunya, Barcelona, Spain, 2000.
40. Piezoelectric Ceramics. Southampton, U.K.: Morgan Electro Ceramics, Inc., 2007, p. 40.
41. K. T. Gillen, R. L. Clough, and J. Wise, "Prediction of elastomer lifetimes from accelerated thermal-aging experiments," Polym. Durabil., vol. 249, pp. 557-575, 1996.
42. F. Schneider, T. Fellner, J. Wilde, and U. Wallrabe, "Mechanical properties of silicones for MEMS," J. Micromech. Microeng., vol. 18, no. 6, p. 9, 2008.
43. K. L. Ngai and C. M. Roland, "A constraint dynamics approach to rubber elasticity," Rubber Chem. Technol., vol. 66, no. 5, pp. 817-826, 1993.