Thermal and mechanical analysis of high-power LEDs with ceramic packages

IEEE Transactions on Device and Materials Reliability

Volumn 8, Issue 2, 2008, Pages 297-303

  Hu, Jianzheng ^a   Yang, Lianqiao ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MOLDS; CERAMIC PACKAGES; COEFFICIENTS OF THERMAL EXPANSIONS; FINITE-ELEMENT METHODS; HIGH-POWER LEDS; HIGH-POWER LIGHT-EMITTING DIODES; INTERFACE LAYERS; MECHANICAL CHARACTERISTICS; MOUNTING PROCESS; PLASTIC PACKAGES; STRESS COMPONENTS; THERMAL AND MECHANICAL ANALYSIS; THERMAL PERFORMANCE; THERMAL RESISTANCES; THERMO MECHANICALS; THERMO-MECHANICAL SIMULATIONS; THERMO-MECHANICAL STRESS; TRANSIENT THERMAL MEASUREMENTS;

CERAMIC MATERIALS; LIGHT EMITTING DIODES; MOLDS; THERMOMECHANICAL TREATMENT;

THERMAL EXPANSION;

EID: 57549117854     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2008.920298     Document Type: Article

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