Thermal management of high power LEDs: Impact of die attach materials

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 239-242

  You, J P ^a   He, Y ^a   Shi, F G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; DC GENERATORS; DIES; FLOW MEASURING INSTRUMENTS; HEAT FLUX; HEAT TRANSFER; LIGHT EMITTING DIODES; MICROSYSTEMS; TECHNOLOGY; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; THERMAL VARIABLES CONTROL; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

DIE-ATTACH MATERIALS; HEAT FLOW PATH; HEAT FLOW RATES; HIGH-POWER LEDS; HIGH-POWER LIGHT-EMITTING DIODES; IN-SITU MEASUREMENTS; INPUT POWERS; JUNCTION TEMPERATURES; LIFE SPAN; LIGHT OUTPUT; PHYSICAL PROPERTIES; THERMAL MANAGEMENT; THERMAL RESISTANCE;

PACKAGING MATERIALS;

EID: 48649105354     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433607     Document Type: Conference Paper

References (8)

1. C. Kirchner, V. Schwegler, F. Eberhard, M. Kamp, K.J. Ebeling, K. Kornitzer and S. Poroswski, "Homoepitaxial growth of GaN by metalorganic vapor phase epitaxy: A benchmark for GaN technology" , J. Appl. Lett. 75 (8), 1098-1100 (1999)
2. R. Windisch, C. Rooman, B. Dutta, A. Knobloch, G. Borghs, G.H. Dohler, and P. Heremans, "Light-extraction mechanisms in high-efficiency surface-textured light-emitting diodes", IEEE J. Selected Topics Quantum Electronics, 8, 248-255 (2002)
3. N. Narendran, Y. Gu, J.P. Freyssinier, H. Yu, L. Deng, "Solid-state lighting: failure analysis of white LEDs", J. Crystal Growth 268 (3-4), 449-456 (2004)
4. V.A. Chiriac and T.Y.T. Lee, "Impact of die attach material and substrate design on RF GaAs power amplifier devices thermal performance", J. Electronic Packaging, 125 (4), 589-596 (2003)
5. S. Todoroki, M. Sawai , and K. Aiki, "Temperature distribution along the striped active region in high-power GaAlAs visible lasers", J. Appl. Phys., 58, 1124-1128 (1985)
6. S. Murata and H. Nakada, "Adding a heat bypass improves the thermal characteristics of a 50 μm spaced 8-beam laser diode array", J. Appl. Phys., 72, 2514- 2516 (1992)
7. P.W. Epperlein and G.L. Bona, "Influence of the vertical structure on the mirror facet temperatures of visible GaInP quantum well lasers", Appl. Phys. Lett., 62, 3074-3076 (1993)
8. D.C. Hall, L. Goldberg, and D. Mehuys, "Technique for lateral temperature profiling in optoelectronic devices using a photoluminescence microprobe", Appl. Phys. Lett., 61, 384-386 (1992)