Thermal design of ceramic packages for high power light-emitting diodes

Semiconductor Science and Technology

Volumn 22, Issue 7, 2007, Pages 705-708

  Yang, Lianqiao ^a   Hu, Jianzheng ^a   Jang, Sunho ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CHIP SCALE PACKAGES; ELECTRIC POWER UTILIZATION; THERMAL EFFECTS; THERMAL INSULATION;

LED PACKAGES; THERMAL DESIGN; THERMAL RESISTANCES;

LIGHT EMITTING DIODES;

EID: 34547345935     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/22/7/005     Document Type: Article

References (11)

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