Thermal analysis of GaN-based LEDs using the finite element method and unit temperature profile approach

Physica Status Solidi (B) Basic Research

Volumn 241, Issue 12, 2004, Pages 2681-2684

  Lee, Tae Hee ^a   Kim, Lan ^a   Hwang, Woong Joon ^a   Lee, C C ^b   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; GALLIUM NITRIDE; HEAT LOSSES; MATHEMATICAL MODELS; PRODUCT DESIGN; THERMOANALYSIS;

INTERFACING PROCESS; NON-FLAT SURFACES; TEMPERATURE PROFILE APPROACH; THERMAL MODELING;

LIGHT EMITTING DIODES;

EID: 7444229734     PISSN: 03701972     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssb.200405099     Document Type: Conference Paper

References (5)

1. J. Park, M. W. Shin, and C. C. Lee, IEEE Electron Device Lett. 24(7), 424 (2003).
2. C. C. Lee and A. L. Palisoc, IEEE Trans. Compon. Hybrids Manuf. Technol. 11(4), 485 (1998).
3. C. C. Lee and D. H. Chien, PAMICE- A program for the potential analysis of multi-layer infinite plate structures with circular embedded sources, Version 1.0, Software and Users Manual, 1995, unpublished.
4. W. J. Hwang, T. H. Lee, L. Kim, and M. W. Shin, phys. stat. sol. (c) 1, 2429 (2004).
5. User's Manual of ANSYS, Theory of Thermal Modeling, 2001.