Thermal and mechanical analysis of high-power light-emitting diodes with ceramic packages

Collection of Papers Presented at The 13th International Workshop on THERMal INvestigation of ICs and Systems, THERMINIC

Volumn , Issue , 2007, Pages 77-81

  Hu, Jianzheng ^a   Yang, Lianqiao ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FORMING; LIGHT EMISSION; LIGHT EMITTING DIODES; MOLDS; PLASTICS; STRESSES; THERMAL SPRAYING; THERMOMECHANICAL TREATMENT;

CERAMIC MOULDS; CERAMIC PACKAGING; COEFFICIENTS OF THERMAL EXPANSIONS; HIGH-POWER LEDS; HIGH-POWER LIGHT-EMITTING DIODES; INTERFACE LAYERS; LED PACKAGING; MECHANICAL ANALYSIS; MECHANICAL CHARACTERISTICS; MECHANICAL SIMULATIONS; MECHANICAL STRESSING; MOUNTING PROCESS; PLASTIC MOULDS; PLASTIC PACKAGING; THERMAL PERFORMANCE; THERMAL RESISTANCE;

THERMAL EXPANSION;

EID: 48049094400     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/THERMINIC.2007.4451751     Document Type: Conference Paper

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