Effect of chip and bonding defects on the junction temperatures of high-brightness light-emitting diodes

Optical Engineering

Volumn 44, Issue 11, 2005, Pages

  Arik, Mehmet ^a   Weaver, Stanton ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

Chip and bump defects; Finite element analysis; High brightness LEDs; Light emitting diodes; Microscopic infrared imaging; Thermal management

Indexed keywords

FINITE ELEMENT METHOD; HEAT RESISTANCE; INFRARED IMAGING; LIGHTING; MATHEMATICAL MODELS; RELIABILITY; SEMICONDUCTOR JUNCTIONS; TEMPERATURE;

BUMP DEFECTS; CHIP DEFECTS; MICROSCOPIC INFRARED IMAGING; THERMAL MANAGEMENT;

LIGHT EMITTING DIODES;

EID: 33747622119     PISSN: 00913286     EISSN: 15602303     Source Type: Journal    
DOI: 10.1117/1.2130127     Document Type: Article

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