Thermal challenges in the future generation solid state lighting applications: Light emitting diodes

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 113-120

  Arik, M ^a   Petroski, J ^a   Weaver, S ^a  

^a GENERAL ELECTRIC COMPANY   (United States)

Author keywords

Brightness; Engineering management; Light emitting diodes; Packaging; Power engineering and energy; Power system management; Solid state lighting; Thermal engineering; Thermal management; Tungsten

Indexed keywords

DIODES; LIGHTING; LUMINANCE; PACKAGING; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; TUNGSTEN;

ENGINEERING MANAGEMENT; POWER ENGINEERING AND ENERGIES; POWER SYSTEM MANAGEMENT; SOLID STATE LIGHTING; THERMAL ENGINEERING;

LIGHT EMITTING DIODES;

EID: 84950118720     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012446     Document Type: Conference Paper

References (5)

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3. Craford, M.G., "Visible Light-Emitting Diodes: Past, Present, and Very Bright Future", MRS Bulletin, October 2000.
4. Incropera, F. and DeWitt, D., Fundamentals of Heat Transfer, 1995.
5. SIA, 1997, "The national technology roadmap for semiconductors: Technology needs - 1997", Semiconductor Industry Association, Washington DC.