SCOPUS 정보 검색 플랫폼

Volumn 455, Issue 1-2, 2007, Pages 95-99

Thermal analysis of high power GaN-based LEDs with ceramic package

(4) Yang, Lianqiao a Jang, Sunho a Hwang, Woongjoon a Shin, Moowhan a

Author keywords

Ceramic package; Contact thermal resistance; Finite volume method (FVM); Light emitting diode (LED); Spreading constriction resistance; Transient thermal resistance

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; FINITE VOLUME METHOD; GALLIUM NITRIDE; HEAT RESISTANCE; SURFACE ROUGHNESS; THERMOANALYSIS;

CERAMIC PACKAGE; CONSTRICTION RESISTANCE; CONTACT THERMAL RESISTANCE; SPREADING RESISTANCE; TRANSIENT THERMAL RESISTANCE;

LIGHT EMITTING DIODES;

EID: 33847333709 PISSN: 00406031 EISSN: None Source Type: Journal
DOI: 10.1016/j.tca.2006.11.019 Document Type: Article

Times cited : (85)

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