Experimental and numerical investigation of a microjet-based cooling system for high power LEDs

Heat Transfer Engineering

Volumn 29, Issue 9, 2008, Pages 774-781

  Luo, Xiaobing ^a   Chen, Wei ^a   Sun, Renxia ^a   Liu, Sheng ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMBUSTORS; COOLING SYSTEMS; DC GENERATORS; EXTRACTION; FLOW RATE; HEAT TRANSFER; INDUSTRIAL MANAGEMENT; LIGHT EMITTING DIODES; NUMERICAL METHODS; TEMPERATURE; TEMPERATURE CONTROL; THERMAL EFFECTS; THERMAL VARIABLES CONTROL; THERMOANALYSIS; THERMOCOUPLES; THERMOELECTRIC EQUIPMENT; THERMOMETERS;

ACTIVE COOLING; APPLIED (CO); CHIP ARRAYS; COOLING PERFORMANCE; ENVIRONMENTAL TEMPERATURES; EXPERIMENTAL RESULTS; HIGH-POWER LEDS; IMPINGING JETS; INPUT POWERS; JUNCTION TEMPERATURES; LED CHIPS; LIGHT EMITTING; MICRO JETS; MICRO PUMPING; NUMERICA L RESULTS; NUMERICAL INVESTIGATIONS; NUMERICAL MODELLING; ON FLOW; ON LINE MEASUREMENTS; OPTICAL EXTRACTION; TRANSFER COEFFICIENTS;

COOLING;

EID: 46149089218     PISSN: 01457632     EISSN: 15210537     Source Type: Journal    
DOI: 10.1080/01457630802053777     Document Type: Article

References (13)

1. Zukauskas, A., Shur, M. S., and Gaska, R., Introduction to Solid-State Lighting, pp. 21-29, John Wiley & Sons, New York, 2002.
2. Alan, M., Solid State Lighting-a World of Expanding Opportunities at LED 2002, III-Vs Review, vol. 16, no. 1, pp. 30-33, 2003.
3. Narendran, N., and Gu, Y. M., Life of LED-Based White Light Sources, IEEE Journal of Display Technology, vol. 1, no. 1, pp. 167-171, 2005.
4. Arik, M., and Weaver, S., Chip Scale Thermal Management of High Brightness LED Packages, Fourth International Conference on Solid State Lighting, Proc. SPIE, vol. 5530, pp. 214-223, Denver, Colorado, 2004.
5. Sano, S., Murata, H., and Hattori, K., Development of Flat Panel LED Module with Heat Sink, Mitsubishi Cable Ind. Rev., vol. 86, pp. 112-118, 1993.
6. Petroski, J., Understanding Longitudinal Fin Heat Sink Orientation Sensitivity for Light Emitting Diode (LED) Lighting Applications, Proc. International Electronic Packaging Technical Conference and Exhibition, pp. 111-117, Maui, Hawaii, 2003.
7. Chen, J. H., Liu, C. K., Chao, Y. L., and Tain, R. M., Cooling Performance of Silicon-Based Thermoelectric Device on High Power LED, Proc. 24th International Conference on Thermoelectrics, pp. 53-56, Clemson, South Carolina, 2005.
8. Hsu, C. C., Wang, S. J., and Liu, C. Y., Metallic Wafer and Chip Bonding for LED Packaging, Proc. 5th Pacific Rim Conference on Lasers and Electro-Optics, vol. 1, p. 26, Taipei, Taiwan, 2003.
9. Zhang, K., Xiao, G. W., Wong, C. K. Y., Gu, H. W., Yuen, M. M. F., Chan, P. C. H., and Xu, B., Study on Thermal Interface Material with Carbon Nanotubes and Carbon Black in High-Brightness LED Packaging with Flip-Chip, Proc. 55th Electronic Components and Technology, pp. 60-65, Orlando, Florida, 2005.
10. Acikalin, T., Garimella, S. V., Petroski, J., and Arvind, R., Optimal Design of Miniature Piezoelectric Fans for Cooling Light Emitting Diodes, Proc. Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, vol. 1, pp. 663-671, New York, 2004.
11. Liu, S., Lin, T., Luo, X. B., Chen, M. X., and Jiang, X. P., A Mi-crojet Array Cooling System for Thermal Management of Active Radars and High-Brightness LEDs, Proc. Fifty-Sixth Electronic Components & Technology Conference, pp. 1634-1638, San Diego, Calif., 2006.
12. Wu, S., Mai, J., Tai, Y. C., and Ho, C. M., Micro Heat Exchanger by Using MEMS Impinging Jets, Proc. Twelfth IEEE International Conference on Micro Electro Mechanical Systems, pp. 171-176, Orlando, Florida, 1999.
13. Fleischer, A. S., and Nejad, S. R., Jet Impingement Cooling of a Discretely Heated Portion of a Protruding Pedestal with a Single Round Air Jet, Experimental Thermal and Fluid Science, vol .28, pp. 893-901, 2004.