Plastic deformation and life prediction of solder joints for mechanical shock and drop/impact loading conditions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 507-514

  Syed, Ahmer ^a   Lin, Wei ^a   Sohn, Eun Sook ^b   Cha, Se Woong ^b  

^a AMKOR TECHNOLOGY   (United States)

^b Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLE FRACTURE; COMPUTER SIMULATION; COPPER; DROPS; DUCTILE FRACTURE; LIFE CYCLE; PLASTIC DEFORMATION; STRAIN;

IMPACT LOADING; SOLDER BALLS;

SOLDERED JOINTS;

EID: 35348895562     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373845     Document Type: Conference Paper

References (11)

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11. th Electronic Components and Technology Conference, 2007