Effect of selected process parameters on durability and defects in surface-mount assemblies for portable electronics

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 1, 2008, Pages 51-60

  Ladani, Leila J ^a   Dasgupta, Abhijit ^b   Cardoso, Idelcio ^c   Monlevade, Eduardo ^c  

^a Utah State University   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c Nokia Technology Institute (INdT)   (Brazil)

Author keywords

Defects; Design of experiment (DOE); Manufacturing process; Portable electronics; Reflow; Statistical analysis; Thermomechanical durability

Indexed keywords

DEFECTS; DESIGN OF EXPERIMENTS; DURABILITY; ELECTRONICS PACKAGING; STATISTICAL METHODS; THERMAL CYCLING;

PORTABLE ELECTRONICS; SURFACE-MOUNT ASSEMBLIES; THERMAL CYCLING DURABILITY; THERMOMECHANICAL DURABILITY;

SURFACE MOUNT TECHNOLOGY;

EID: 39449112095     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.914222     Document Type: Article

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