Failure-envelope approach to modeling shock and vibration survivability of electronic and MEMS packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 1, 2008, Pages 104-113

  Lall, Pradeep ^a   Panchagade, Dhananjay R ^a   Choudhary, Prakriti ^b   Gupte, Sameep ^c   Suhling, Jeffrey C ^a  

^a AUBURN UNIVERSITY   (United States)

^b DELL INC   (United States)

^c Submicron Development Center   (United States)

Author keywords

Ball grid array (BGA); Finite element model (FEM); Input output (I O)

Indexed keywords

BALL GRID ARRAYS; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MEMS; STRAIN; STRAIN MEASUREMENT; VIBRATIONS (MECHANICAL); WAVELET TRANSFORMS;

MEMS PACKAGING; SHOCK SURVIVABILITY; VIBRATION SURVIVABILITY;

ELECTRONICS PACKAGING;

EID: 41349099435     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916804     Document Type: Article

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