Microstructure evolution and age hardening in (Ti,Si)(C,N) thin films deposited by cathodic arc evaporation

Thin Solid Films

Volumn 519, Issue 4, 2010, Pages 1397-1403

  Johnson, L J S ^a   Rogstrom L ^a   Johansson, M P ^a,b   Oden M ^a   Hultman, L ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

^b SECO TOOLS AB   (Sweden)

Author keywords

Age hardening; Arc evaporation; Mechanical properties; Thin films; TiSiCN; Transmission Electron Microscopy

Indexed keywords

ARC EVAPORATION; C CONTENTS; CATHODIC ARC EVAPORATION; CEMENTED CARBIDE SUBSTRATES; DENSE COLUMNAR MICROSTRUCTURE; DIFFUSION PATHWAYS; ELASTIC RECOIL DETECTION ANALYSIS; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; ENERGY-LOSS SPECTROSCOPY; FILM HARDNESS; ISOTHERMALLY ANNEALED; MICROSTRUCTURE EVOLUTIONS; NANOCRYSTALLINE GRAINS; SI CONTENT; TEMPERATURE THRESHOLDS; TISICN; TRANSMISSION ELECTRON;

CARBIDES; CHROMIUM; COBALT; ELECTRON ENERGY LOSS SPECTROSCOPY; ELECTRONS; ENERGY DISPERSIVE SPECTROSCOPY; ENERGY DISSIPATION; EVAPORATION; GRAIN BOUNDARIES; MECHANICAL PROPERTIES; MICROSTRUCTURE; NANOINDENTATION; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SODIUM CHLORIDE; SUBSTRATES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; VAPOR DEPOSITION; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAY SPECTROSCOPY;

AGE HARDENING;

EID: 78349304165     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2010.08.150     Document Type: Article

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