Influence of Si on the microstructure of arc evaporated (Ti,Si)N thin films; evidence for cubic solid solutions and their thermal stability

Surface and Coatings Technology

Volumn 200, Issue 5-6, 2005, Pages 1535-1542

  Flink, Axe ^a   Larsson, T ^b   Sjolen J ^c   Karlsson, L ^c   Hultman, L ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

^b SECO Tools AB ^*  (Sweden)

^c SECO TOOLS AB   (Sweden)

Author keywords

Arc evaporation; Microstructure; Nitrides; Solid solution; Thin films; Transmission electron microscopy (TEM)

Indexed keywords

COMPOSITION EFFECTS; CRYSTAL MICROSTRUCTURE; DEPOSITION; EVAPORATION; SILICON; SILICON NITRIDE; SOLID SOLUTIONS; THERMODYNAMIC STABILITY; THIN FILMS; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN CARBIDE;

ARC EVAPORATION; FEATHER-LIKE NANOSTRUCTURE; SOLID-SOLUTION HARDENING;

INORGANIC COATINGS;

COATING;

EID: 28844481918     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.08.096     Document Type: Article

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