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Volumn 38, Issue 12, 2009, Pages 2712-2719

Methodology for analyzing strain states during in situ thermomechanical cycling in individual lead-free solder joints using synchrotron radiation

(3) Bieler, Thomas R a Lee, Tae Kyu b Liu, Kuo Chuan b

a MICHIGAN STATE UNIVERSITY (United States)

b CISCO SYSTEMS (United States)

Author keywords

Internal strain; Lead free solder; Microstructure evolution; Synchrotron; Thermal cycling

Indexed keywords

A-THERMAL; CRYSTAL DIRECTION; CRYSTAL PLANES; IN-SITU; INTERNAL STRAINS; LAUE PATTERNS; LEAD FREE SOLDERS; LEAD-FREE SOLDER; LEAD-FREE SOLDER JOINT; LOCAL STRAINS; MICROSTRUCTURE EVOLUTION; MULTICRYSTALS; PLASTIC STRESS; SN GRAINS; SOLDER JOINTS; STRAIN STATE; THERMAL CYCLE; THERMOMECHANICAL CYCLING;

ELECTROMAGNETIC WAVES; LEAD; MICROSTRUCTURE; SINGLE CRYSTALS; STRAIN; SYNCHROTRON RADIATION; SYNCHROTRONS; THERMAL CYCLING; TIN;

CRYSTAL ORIENTATION;

EID: 72549117214 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0919-8 Document Type: Article

Times cited : (17)

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