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Journal of Materials Science: Materials in Electronics
Volumn 22, Issue 1, 2011, Pages 14-19
Effect of Bi content on spalling behavior of Sn-Bi-Zn-Ag/Cu interface
Author keywords

[No Author keywords available]
Indexed keywords

CU SUBSTRATE; IMC LAYER; INTERFACIAL STRUCTURES; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; SOLDER LAYERS; SPALLING BEHAVIOR; WEIGHT PERCENT;
EID: 78049528704     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0075-1     Document Type: Article
Times cited : (13)
References (29)
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