Solid-state reactions at the Sn-9Zn-xAg lead-free solders/Cu interface

Electrochemical and Solid-State Letters

Volumn 6, Issue 6, 2003, Pages

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Wang, Moo Chin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER COMPOUNDS; DIFFRACTOMETERS; ELECTRON MICROSCOPES; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY SPECTROMETERS;

ENERGY DISPERSIVE SPECTROMETER; SCANNING ELECTRON MICROSCOPE; SOLID STATE REACTIONS; TRANSMISSION ELECTRON MICROSCOPE; X RAY DIFFRACTOMETER;

INTERFACES (MATERIALS);

EID: 0038023064     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1566534     Document Type: Article

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