Retardation of spalling by the addition of Ag in Sn-Zn-Bi solder with the Au/Ni metallization

Materials Science and Engineering: A

Volumn 445-446, Issue , 2007, Pages 686-690

  Sharif, A ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Ag; Extended reflow; Intermetallic compounds; Microstructure; Shearing load; Sn Zn 3Bi solder

Indexed keywords

INTERMETALLICS; METALLIZING; SILVER; SOLDERING ALLOYS; SPALLING; SURFACE REACTIONS; TIN ALLOYS;

BALL GRID ARRAY; EXTENDED REFLOW; FRACTURE SURFACES;

ADDITION REACTIONS;

ADDITION REACTIONS; INTERMETALLICS; METALLIZING; SILVER; SOLDERING ALLOYS; SPALLING; SURFACE REACTIONS; TIN ALLOYS;

EID: 33845888520     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.10.002     Document Type: Article

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