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Journal of Materials Science: Materials in Electronics

Volumn 19, Issue 12, 2008, Pages 1160-1168

Effect of the soldering time on the formation of interfacial structure between Sn-Ag-Zn lead-free solder and Cu substrate

(5) Wan, Jing Bo a Liu, Yong Chang a Wei, Chen a Jiang, Peng a Gao, Zhi Ming a

a TIANJIN UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

CU SUBSTRATES; INTERFACIAL STRUCTURES; LEAD-FREE SOLDERING; MICROSTRUCTURAL OBSERVATIONS;

BRAZING; COPPER; SILVER; SOLDERED JOINTS; SOLDERING; TIN; WELDING; ZINC;

LEAD;

EID: 53749095563 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-007-9505-0 Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.