Effects of composition and cooling rate on the microstructure of Sn-3.7Ag-0.9Zn-Bi solders

Applied Physics A: Materials Science and Processing

Volumn 96, Issue 4, 2009, Pages 969-973

  Wang, X ^a   Liu, Y C ^a   Wei, C ^a   Yu, L M ^a   Gao, Z M ^a   Dong, Z Z ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION OF; COOLING RATES; INTERMETALLIC COMPOUNDS; MICROSTRUCTURAL ANALYSIS; SN DENDRITES; SN-AG-ZN; WEIGHT PERCENT;

BISMUTH COMPOUNDS; COOLING; EUTECTICS; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; ZINC;

TIN;

EID: 70350575275     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-009-5116-3     Document Type: Article

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