Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film

Journal of Micromechanics and Microengineering

Volumn 20, Issue 10, 2010, Pages

  Kim, Kyung Soo ^a   Ha, Chang Wan ^a   Jang, Tae Young ^b   Joung, Sang Won ^c   Yun, Won Soo ^d  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SK Energy Corporation   (South Korea)

^c RandD Center   (South Korea)

^d Korea Polytechnic University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; BONDING TIME; CONDUCTIVE PARTICLE; CONTACT SURFACE; CURING TIME; FAST CURING; FLIP-CHIP INTERCONNECTION; INTERNAL TEMPERATURE; LATERAL DIRECTIONS; LATERAL VIBRATIONS; LCD DRIVERS; SHEAR TESTS; THERMO-COMPRESSION; THERMOSONIC FLIP-CHIP BONDING; THERMOSONICS; ULTRASONIC VIBRATION;

ANISOTROPY; CONDUCTIVE FILMS; CURING; ULTRASONIC EFFECTS; ULTRASONIC WAVES; ULTRASONICS; WATER ABSORPTION;

FLIP CHIP DEVICES;

EID: 78049352426     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/10/105015     Document Type: Article

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