Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application

Microelectronics Reliability

Volumn 48, Issue 2, 2008, Pages 293-299

  Hwang, J S ^a   Yim, M J ^a   Paik, K W ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; FLIP CHIP DEVICES; GLASS BONDING; THERMAL CYCLING; THERMAL EFFECTS; X RAY SCATTERING;

ANISOTROPIC CONDUCTIVE FILMS (ACF); BONDING TEMPERATURE; FLIP CHIP INTERCONNECTS; ORGANIC SUBSTRATES;

CONDUCTIVE FILMS;

EID: 44249084430     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.097     Document Type: Article

References (10)

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