Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 918-923

  Ki, Won Lee ^a   Hyoung, Joon Kim ^a   Myung, Jin Yim ^a   Kyung, Wook Paik ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CURING; FLIP CHIP DEVICES; GLASS BONDING; INTERCONNECTION NETWORKS; SUBSTRATES;

ANISOTROPIC CONDUCTIVE FILMS (ACF); FLIP CHIP INTERCONNECTION; SUBSTRATE TEMPERATURE; ULTRASONIC VIBRATION;

CONDUCTIVE FILMS;

EID: 33845583525     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645764     Document Type: Conference Paper

References (3)

1. I. Watanabe et al., "Packaging Technologies using Anisotropic Conductive Adhesive Films in FPDs", Proc. Asia Display/IDW, pp. 553-556, 2001
2. J. Liu, A. Tolvgard, J. Malmodin, and Z. Lai, " A Reliable and Environmentally Friendly Packaging Technology-Flip Chip Joining Using Anisotropically Conductive Adhesive", IEEE Trans. Comp. Packag., Manufact. Technol., Vol. 22, No. 2, pp.186-190, 1999
3. P. Lawyer, D., Choudhury, M. Weteel and D. Rensch, "Thermosonic Bonding of High-power Semiconductor Devices for Integration with Planar Microstrip Circuitry", Proc. Inter. Electron. Manuf. Technol. Sym., pp.390-393, 1998