SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2691-2696

Reliability of adhesive interconnections for application in display module

(4) Kim, Jong Woong a Lee, Young Chul a Kim, Dae Gon a Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

Author keywords

Anisotropic conductive film; Connection resistance; Display; Non conductive film; Thermal shock

Indexed keywords

ADHESIVES; DISPLAY DEVICES; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; THERMAL SHOCK;

ANISOTROPIC CONDUCTIVE FILM (ACF); CONNECTION RESISTANCE; DIFFERENT CONDUCTION BEHAVIORS; FLEXIBLE PRINTED CIRCUIT (FPC); NON-CONDUCTIVE FILM (NCF); OHMIC BEHAVIOR;

INTERCONNECTION NETWORKS;

EID: 34548857328 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2007.05.066 Document Type: Article

Times cited : (23)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.