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Volumn , Issue , 2008, Pages

Using ultrasonic energy for reducing ACF bonding process time

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PRESSURE; BONDING PROCESS; CONVENTIONAL METHODS; FAILURE RATE; HIGH PRECISION; HIGH TEMPERATURE PROCESS; LCD DRIVERS; MECHANICAL VIBRATIONS; NEW CONCEPT; THERMO-COMPRESSION; ULTRASONIC BONDING; ULTRASONIC ENERGY;

EID: 77955121952     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507776     Document Type: Conference Paper
Times cited : (4)

References (16)
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  • 2
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  • 3
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    • Proc. Conf. on 2007 Electronic Components and Technology , pp. 480-486
    • Lee, K.W.1    Kim, H.J.2    Kim, I.3    Paik, K.W.4
  • 4
    • 0032687044 scopus 로고    scopus 로고
    • Polymer adhesion by ultrasonic welding
    • E. Sancaktar, "Polymer adhesion by ultrasonic welding," Journal of Adhesion Science and Technology, Vol. 13, no. 2 (1999), pp. 179-201
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  • 5
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    • Nonhof, C.J.1    Luiten, G.A.2
  • 6
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    • Technological special features of ultrasound welding polymer films
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  • 7
    • 33845583525 scopus 로고    scopus 로고
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  • 8
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  • 11
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    • Reliability and thermodynamic studies of an anisotropic conductive adhesive film (ACAF) prepared from epoxy/rubber resins
    • J.-Y. Kim, S. Kwon, D. Ihm, "Reliability and thermodynamic studies of an anisotropic conductive adhesive film (ACAF) prepared from epoxy/rubber resins," Journal of Materials Processing Technology, Vol. 152 (2004), pp. 357-362.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.