Using ultrasonic energy for reducing ACF bonding process time

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2008, Pages

  Jang, Tae Young ^a   Yun, Won Su ^b   Kim, Soo Hyun ^a   Kim, Kyung Soo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Polytechnic University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PRESSURE; BONDING PROCESS; CONVENTIONAL METHODS; FAILURE RATE; HIGH PRECISION; HIGH TEMPERATURE PROCESS; LCD DRIVERS; MECHANICAL VIBRATIONS; NEW CONCEPT; THERMO-COMPRESSION; ULTRASONIC BONDING; ULTRASONIC ENERGY;

CONDUCTIVE MATERIALS; ULTRASONICS; VIBRATIONS (MECHANICAL);

ULTRASONIC TESTING;

EID: 77955121952     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507776     Document Type: Conference Paper

References (16)

1. B. Vandevelde, E. Beyne, "Improved thermal fatigue reliability for flip chip assemblies using redistribution techniques." IEEE Transaction on Advanced Packaging, Vol. 23. no. 2 (2000), pp. 239-246
2. P. Garrou. "Wafer level chip scale packaging (WL-CSP): An overview," IEEE Transaction on Advanced Packaging, Vol. 23, no. 2 (2000), pp. 198-205
3. K.W Lee, H.J Kim, I. Kim. K.W Paik. "Ultrasonic Anisotropic Conductive Film (ACFs) Bonding of Flexible Substrates on Organic Rigid Boards at Room Temperature," Proc. Conf. on 2007 Electronic Components and Technology, pp. 480-486
4. E. Sancaktar, "Polymer adhesion by ultrasonic welding," Journal of Adhesion Science and Technology, Vol. 13, no. 2 (1999), pp. 179-201
5. C.J Nonhof, G.A. Luiten, "Estimates for process conditions during the ultrasonic welding of thermoplastics," Polymer Engineering and Science, Vol. 36, no. 9 (1996), pp. 1177-1183
6. S.S. Volkov, "Technological special features of ultrasound welding polymer films," Welding International, Vol. 15, no. 3 (2001), pp. 243-248
7. K.W Lee, H.J Kim, M.J Yim, K.W Paik, "Curing and Bonding Behaviors of Anisotropic Conductive Films (ACFs) by Ultrasonic Vibration for Flip Chip Interconnection", Proc. Conf. on 56th Electronic Components and Technology, 2006, pp. 918-923
8. Y. C. Chan, "Behavior of Anisotropic Conductive Film (ACF) Joint Under Mechanical Shock," Journal of Electronic Packaging, Vol. 127 (2005). pp. 375-380.
9. J.H. Kim, B.C. Kim, C.D. Yoo. "Soldering Method Using Longitudinal Ultrasonic," IEEE Tranactions of Components, Packaging and Manufacturing Technology. B, Vol. 28, Issue. 3 (2005), pp. 493-498
10. R. Aschenbrenner, A. Ostmann, G. Motulla, E. Zakel, H. Reichl, "Flip Chip Attachment Using Anisotropic Conductive Adhesives and Electroless Nickel Bumps" IEEE Trans. on Components, Packaging, and Manufacturing Technology, Vol. 20 (1997), No. 2, pp. 95-100.
11. J.-Y. Kim, S. Kwon, D. Ihm, "Reliability and thermodynamic studies of an anisotropic conductive adhesive film (ACAF) prepared from epoxy/rubber resins," Journal of Materials Processing Technology, Vol. 152 (2004), pp. 357-362.
12. Y. C. Chan, D.Y. Luk, "Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly? Different bonding temperature," Microelectronics Reliability, Vol. 42 (2002), pp. 1185-1194.
13. Y.C. Chan, D.Y. Luk, "Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure," Microelectronics Reliability, Vol. 42 (2002), pp. 1195-1204.
14. Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu, "Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages," Microelectronics Reliability, Vol. 44 (2004), pp. 295-302
15. S.-W. Joung, W.-S. Yun, K.-S. Kim, "Ultrasonic ACF Bonding Technique for Mounting LCD Driver ICs", Journal of Control, Automation, and systems Engineering (in Korean), Vol. 14, No. 6 (2008), pp. 543-547.
16. A. Song, H. Lei, H.-X. Li, "Experimental Identification of parasitic Vibrations on Ultrasonic Bonding Transducer," Proc. Conf. on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006 (HDP'06), pp. 78-81.