Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding

Journal of Micromechanics and Microengineering

Volumn 18, Issue 12, 2008, Pages

  Lee, Jihye ^a   Yoo, Choong D ^b  

^a Korea Institute of Machine and Materials   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT; BONDING; BRAZING; COPPER; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; SILVER; SOLDERING ALLOYS; TIN; WELDING;

BOND QUALITIES; BOND STRENGTHS; BONDING CONDITIONS; BONDING TIMES; ELECTRONIC PACKAGING; FLUXLESS; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; LONGITUDINAL VIBRATIONS; SOLDER BUMPS; TEMPERATURE BONDINGS; VISCO PLASTICS;

SOLDERING;

EID: 58149345512     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/12/125002     Document Type: Article

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