Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

Microelectronic Engineering

Volumn 85, Issue 11, 2008, Pages 2202-2206

  Eom, Yong Sung ^a   Jang, Keonsoo ^b   Moon, Jong Tae ^a   Nam, Jae Do ^b   Kim, Jong Min ^c  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

Anisotropic conductive adhesive; Electrical resistance; High reliability; Low melting point solder

Indexed keywords

ABS RESINS; ADHESIVE JOINTS; ANISOTROPY; BRAZING; ELECTRIC PROPERTIES; FLIP CHIP DEVICES; MELTING; POLYMER MELTS; POLYMERS; RHEOLOGY; SHEAR STRENGTH; STEELMAKING; THERMOCHEMISTRY; WELDING;

ANISOTROPIC CONDUCTIVE ADHESIVE; ANISOTROPIC CONDUCTIVE ADHESIVES; BEFORE AND AFTER; BONDING MECHANISMS; BONDING PROCESSES; CHIP BONDINGS; ELECTRICAL; ELECTRICAL PROPERTIES; ELECTRICAL RESISTANCE; ELECTRICAL RESISTANCES; HIGH RELIABILITY; LOW MELTING POINT SOLDER; LOW MELTING POINTS; MECHANICAL CHARACTERIZATIONS; MECHANICAL PERFORMANCES; OPTICAL MICROSCOPES; PACKAGING TECHNOLOGIES; PRESSURE COOKER TESTS; REDUCTANT; RELIABLE; RHEOLOGICAL PROPERTIES; SOLDER POWDERS;

MELTING POINT;

EID: 54049147275     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.05.038     Document Type: Article

References (12)

1. J.H. Lau, FlipChip Technologies, McGraw-Hill, New York, 1995, pp. 123-179.
2. M.L. Minges, Electronics Materials Handbook Packaging, ASM International, 1989.
3. Kwon W.S., and Paik K.W. Contraction stress build-up of anisotropic conductive film (ACFs) for flip-chip interconnection: effect of thermal and mechanical properties of ACFs. Journal of Applied Polymer Science 93 (2004) 2634-2641
4. Kim J.W., Moon W.C., and Jung S.B. Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection. Microelectronic Engineering 83 (2006) 2335-2340
5. Sagawa T., Oyama M., Haga S., Kawahira T., Ishii T., Kurosawa M., Koshihara M., and Goto H. Anisotropic conductive paste (ACP) connection technology. Fujikura Technical Review (2005) 33-37
6. Kivilahti J., and Savolainen P. Anisotropic adhesives for flip-chip bonding. Journal of Electronics Manufacturing 5 4 (1995) 245-252
7. Savolainen P., and Kivilahti J. Electrical properties of solder filled anisotropically conductive adhesives. Journal of Electronics Manufacturing 5 1 (1995) 19-26
8. Kim J.M., Yasuda K., Rito M., and Fujimoto K. Isotropic conductive adhesive with fusible filler particles. Journal of Electronic Materials 33 11 (2004) 1331-1337
9. Kim J.M., Yasuda K., Rito M., and Fujimoto K. Novel interconnection method using electrically conductive paste with fusible filler. Journal of Electronic Materials 34 50 (2005) 600-604
10. Eom Y.S., Baek J.W., Moon J.T., Nam J.D., and Kim J.M. Characterization of polymer matrix and low melting point solder for anisotropic conductive film. Microelectronic Engineering 85 2 (2008) 327-331
11. Eom Y., Boogh L., Michaud V., Sunderland P., and Manson J. Time-cure-temperature superposition for the prediction of instantaneous viscoelastic properties during cure. Polymer Engineering and Science 40 6 (2000) 1281-1292
12. Gibson R.F. Principles of Composite Material Mechanics (1994), McGraw-Hill, New York