Thermosonic flip-chip bonding using longitudinal ultrasonic vibration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1128-1133

  Tan, Qing ^a   Zhang, Wenge ^a   Schaible, Brian ^a   Bond, Leonard J ^a   Ju, T H ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; END EFFECTORS; SOLDERING; ULTRASONIC EFFECTS; ULTRASONIC PROPAGATION; ULTRASONIC WAVES; VIBRATIONS (MECHANICAL);

THERMOSONIC BONDING; ULTRASONIC VIBRATION;

FLIP CHIP DEVICES;

EID: 0030681535     PISSN: 05695503     EISSN: None     Source Type: None    
DOI: 10.1109/ECTC.1997.606313     Document Type: Conference Paper

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