Effects of anisotropic conductive film viscosity on ACF fillet formation and chip-on-board packages

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 2, 2009, Pages 74-80

  Jang, Kyung Woon ^a,b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Anisotropic conductive film (ACF); Delamination; Fillet; Pressure cooker test (PCT); Viscosity

Indexed keywords

ADHESION STRENGTHS; ANISOTROPIC CONDUCTIVE FILM (ACF); CHIP ON BOARDS; EPOXY MATERIALS; FILLET; FLIP-CHIP ASSEMBLIES; MOISTURE ABSORPTIONS; PRESSURE COOKER TEST (PCT); SCANNING ELECTRON MICROSCOPY IMAGES; THERMO-MECHANICAL PROPERTIES;

ANISOTROPY; CHIP SCALE PACKAGES; DELAMINATION; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; MOLECULAR WEIGHT; SCANNING ELECTRON MICROSCOPY; STEEL SHEET; VISCOSITY;

CONDUCTIVE FILMS;

EID: 67349209083     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2015288     Document Type: Article

References (6)

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