Adhesion energies of Cr thin films on polyimide determined from buckling: Experiment and model

Acta Materialia

Volumn 58, Issue 16, 2010, Pages 5520-5531

  Cordill, M J ^a   Fischer, F D ^b   Rammerstorfer, F G ^c   Dehm, G ^a  

^a UNIVERSITY OF LEOBEN   (Austria)

^b INSTITUTE OF MECHANICS   (Austria)

^c VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Adhesion; Buckling; Polymers; Scanning electron microscopy; Thin films

Indexed keywords

ADHESION ENERGY; CR FILM; ENERGY BALANCE MODELS; FLEXIBLE ELECTRONIC DEVICES; INTERFACIAL ADHESIONS; LATERAL CONTRACTION; MECHANICAL TESTS; METAL FILM; METAL POLYMER INTERFACES; MINIMUM VALUE; MODELING APPROACH; POLYIMIDE SUBSTRATE; POLYMER SUBSTRATE; TENSILE TESTS; WEAK POINTS;

ADHESION; BUCKLING; CHROMIUM; POLYIMIDES; POLYMERS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TENSILE TESTING; THICK FILMS; THIN FILMS; VAPOR DEPOSITION;

POLYMER FILMS;

EID: 77955423164     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.06.032     Document Type: Article

References (39)

1. M.H. Lin, Y.L. Lin, K.P. Chang, K.C. Su, and T. Wang Microelectron Reliab 45 2005 1061
2. S.M. Yi, J.U. An, S.S. Hwang, J.R. Yim, Y.H. Huh, and Y.B. Park Thin Solid Films 516 2008 2325
3. N. Lu, X. Wang, Z. Suo, and J. Vlassak Appl Phys Lett 91 2007 221909-1
4. Y. Letterrier Prog Mater Sci 48 2003 1
5. J. Andersons, S. Tarasovs, and Y. Letterier Thin Solid Films 517 2009 2007
6. S.P. Tiwari, P. Srinivas, S. Shriram, N.S. Kale, S.G. Mhaisalkar, and V.R. Rao Thin Solid Films 516 2008 770
7. S.V. Hainsworth, M.R. McGurk, and T.F. Page Surf Coat Technol 102 1998 97
8. V. Derflinger, H. Braendle, and H. Zimmerman Surf Coat Technol 113 1999 286
9. M.J. Cordill, A. Taylor, J. Schalko, and G. Dehm Metal Mater Trans A 41A 2010 870
10. S. Frank, U.A. Handge, S. Olliges, and R. Spolenak Acta Mater 57 2009 1442
11. H.J. Kim, M.W. Moon, D.I. Kim, K.R. Lee, and K.H. Oh Scripta Mater 57 2007 1016
12. G. Dehm, M. Ruhle, H.D. Conway, and R. Raj Acta Mater 45 1997 489
13. S. Olliges, P.A. Gruber, S. Orso, V. Auzelyte, Y. Ekinci, and H.H. Solak Scripta Mater 58 2008 175
14. D.Y.W. Yu, and F. Spaepen J Appl Phys 95 2004 2991
15. Y. Xiang, T. Li, Z. Suo, and J. Vlassak Appl Phys Lett 87 2005 161910-1
16. W. Lu, X. Wang, Z. Suo, and J. Vlassak Int J Solids Struct 44 2006 1696
17. M.D. Kriese, N.R. Moody, and W.W. Gerberich J Mater Res 14 1999 3007
18. A.A. Volinsky, N.R. Moody, and W.W. Gerberich Acta Mater 50 2002 441
19. M.D. Kriese, N.R. Moody, and W.W. Gerberich Acta Mater 46 1998 6623
20. M.J. Cordill, D.F. Bahr, N.R. Moody, and W.W. Gerberich IEEE Trans Device Mater Reliabl 4 2004 163
21. A. Bagchi, G.E. Lucas, Z. Suo, and A.G. Evans J Mater Res 9 1994 1734
22. A. Bagchi, and G.E. Evans Thin Solid Films 286 1996 203
23. M.J. Cordill, N.R. Moody, and D.F. Bahr J Mater Res 19 2004 1818
24. A. Lee, B.N. Clemens, and W.D. Nix Acta Mater 52 2004 2081
25. M.J. Cordill, D.F. Bahr, N.R. Moody, and W.W. Gerberich Mater Sci Eng A 443 2007 150
26. R.H. Dauskardt, M. Lane, Q. Ma, and N. Krishna Eng Fract Mech 61 1998 141
27. M. Lane, R.H. Dauskardt, A. Vainchtein, and H. Gao J Mater Res 15 2000 2758
28. J.D. Yeager, D.J. Phillips, D.M. Rector, and D.F. Bahr J Neurosci Methods 173 2008 279
29. M.W. Moon, K.R. Lee, K.H. Oh, and J.W. Hutchinson Acta Mater 52 2004 3151
30. B. Audoly Phys Rev Lett 83 1999 4124
31. J.W. Hutchinson, and Z. Suo Adv Appl Mech 29 1992 63
32. H. Chai, C.D. Babcock, and W.G. Knauss Int J Solids Struct 17 1981 1069
33. F. Gruttmann, and V.D. Pham Comput Mech 41 2008 361
34. G. Parry, C. Coupeau, J. Colin, and A. Cimetiere J Mech Mat Struct 4 2009 121
35. W.L. Yin J Compos Mater 22 1988 502
36. V.V. Bolotin Int J Non-Linear Mech 29 1994 569
37. A. Kelly, and W.R. Tyson J Mech Phys Solids 13 1965 329
38. D.C. Agrawal, and R. Raj Acta Metall 37 1989 1265
39. C. Coupeau, J.F. Naud, F. Cleymand, P. Goudeau, and J. Grilhe Thin Solid Films 253 1999 194