Evaluation of thin film adhesion to a compliant substrate by the analysis of progressive buckling in the fragmentation test

Thin Solid Films

Volumn 517, Issue 6, 2009, Pages 2007-2011

  Andersons, J ^a   Tarasovs, S ^a   Leterrier, Y ^b  

^a UNIVERSITY OF LATVIA   (Latvia)

^b LABORATOIRE DE TECHNOLOGIE DES COMPOSITES ET POLYMÈRES LTC   (Switzerland)

Author keywords

Adhesion; Coatings; Interfaces; Silicon oxide

Indexed keywords

ADHESION; BUCKLING; COATINGS; FINITE ELEMENT METHOD; NORMAL DISTRIBUTION; OXIDES; POLYETHYLENE TEREPHTHALATES; PROBABILITY DISTRIBUTIONS; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON COMPOUNDS; STRAIN; THERMOPLASTICS; THREE DIMENSIONAL;

ACCUMULATION PROCESSES; APPLIED STRAINS; BEFORE AND AFTER; BUCKLE FORMATIONS; COMPLIANT SUBSTRATES; ELASTIC ENERGIES; FILM ADHESIONS; FRAGMENTATION TESTS; HIGH STRAINS; INTERFACE ADHESIONS; INTERFACE TOUGHNESSES; INTERFACES; INTERFACIAL TOUGHNESSES; LINEAR DENSITIES; LINEAR FINITE ELEMENT MODELS; PLASTIC DISSIPATIONS; PROBABILISTIC FEATURES; RANDOM LOCATIONS; SILICON OXIDE; SUBSTRATE SYSTEMS; TOTAL ENERGIES;

SUBSTRATES;

EID: 58149161676     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.10.072     Document Type: Article

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