Adhesion measurements using telephone cord buckles

Materials Science and Engineering: A

Volumn 443, Issue 1-2, 2007, Pages 150-155

  Cordill, M J ^a   Bahr, D F ^b   Moody, N R ^c   Gerberich, W W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Adhesion; Blisters; Buckles; Interfaces; Thin films

Indexed keywords

ADHESION; DELAMINATION; INTERFACES (MATERIALS); MORPHOLOGY; THIN FILMS;

ADHESION ENERGY; INFLECTION POINT; STRAIGHT-SIDED STRUCTURE; TELEPHONE CORD BUCKLE;

TUNGSTEN;

ADHESION; DELAMINATION; INTERFACES (MATERIALS); MORPHOLOGY; THIN FILMS; TUNGSTEN;

EID: 33751102690     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.08.027     Document Type: Article

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